Multilayer High Frequency / High Isolation Printed Circuit Card Design
Hover mouse over layer: Layer 1: Microstrip Layer 2: Gnd Plane Layer 3: StripLine / Box only routing Layer 4: Gnd Plane(negative) Layer 5: Wiring harness 1 Layer 6: Gnd Plane(negative) Layer 7: Wiring harness 2 Layer 8: Gnd Plane

• Highly integrated assemblies that allow multiple critical signals to be routed on the same board without being corrupted
• Design library of RF subcomponents:  Oscillators, PLL's, Filters
• Baseband processors / microcontrollers can be integrated into the same circuit card assembly

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